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This book first provides a comprehensive coverage of state-of-the-art validation solutions based on real-time signal tracing to guarantee the correctness of VLSI circuits. The authors discuss several key challenges in post-silicon validation and provide automated solutions that are systematic and cost-effective. A series of automatic tracing solutions and innovative design for debug (DfD) techniques are described, including techniques for trace signal selection for enhancing visibility of functional errors, a multiplexed signal tracing strategy for improving functional error detection, a tracing solution for debugging electrical errors, an interconnection fabric for increasing data bandwidth and supporting multi-core debug, an interconnection fabric design and optimization technique to increase transfer flexibility and a DfD design and associated tracing solution for improving debug efficiency and expanding tracing window. The solutions presented in this book improve the validation quality of VLSI circuits, and ultimately enable the design and fabrication of reliable electronic devices.

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Electrical overstress (EOS) and Electrostatic discharge (ESD) pose one of the most dominant threats to integrated circuits (ICs). These reliability concerns are becoming more serious with the downward scaling of device feature sizes. Modeling of Electrical Overstress in Integrated Circuits presents a comprehensive analysis of EOS/ESD-related failures in I/O protection devices in integrated circuits.

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Polycrystalline Silicon for Integrated Circuits and Displays, Second Edition presents much of the available knowledge about polysilicon. It represents an effort to interrelate the deposition, properties, and applications of polysilicon. By properly understanding the properties of polycrystalline silicon and their relation to the deposition conditions, polysilicon can be designed to ensure optimum device and integrated-circuit performance.

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In electronic circuit and system design, the word noise is used to refer to any undesired excitation on the system. In other contexts, noise is also used to refer to signals or excitations which exhibit chaotic or random behavior. The source of noise can be either internal or external to the system. For instance, the thermal and shot noise generated within integrated circuit devices are in­ ternal noise sources, and the noise picked up from the environment through electromagnetic interference is an external one. Electromagnetic interference can also occur between different components of the same system. In integrated circuits (Ies), signals in one part of the system can propagate to the other parts of the same system through electromagnetic coupling, power supply lines and the Ie substrate. For instance, in a mixed-signal Ie, the switching activity in the digital parts of the circuit can adversely affect the performance of the analog section of the circuit by traveling through the power supply lines and the substrate. Prediction of the effect of these noise sources on the performance of an electronic system is called noise analysis or noise simulation. A methodology for the noise analysis or simulation of an electronic system usually has the following four components: 2 NOISE IN NONLINEAR ELECTRONIC CIRCUITS • Mathematical representations or models for the noise sources. • Mathematical model or representation for the system that is under the in­ fluence of the noise sources.

Low-Voltage Low-Power Analog Integrated Circuits brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area.
Low-Voltage Low-Power Analog Integrated Circuits serves as an excellent reference, providing insight into some of the most important issues in the field.

The study of thermal phenomena in microdevices has attracted significant attention recently. The interdisciplinary nature of this topic, however, makes it very difficult for researchers to fully understand details of research results presented in journal articles. For many researchers intending to be active in this field, therefore, a more comprehensive treatment, complete with sufficient background information, is urgently needed.

This book presents a collection of algorithms and VLSI architectures of entropy (or statistical) codecs of recent video compression standards, with focus on the H.264/AVC standard. For any visual data compression scheme, there exists a combination of two, or all of the following three stages: spatial, temporal, and statistical compression. General readers are first introduced with the various algorithms of the statistical coders. The VLSI implementations are also reviewed and discussed. Readers with limited hardware design background are also introduced with a design methodology starting from performance-complexity analyses to software/hardware co-simulation. A typical design of the Contextbased Adaptive Binary Arithmetic Coding (CABAC) encoder is also presented in details. To support System-on-Chip design environment, the CABAC design is wrapped with a SoC-based Wishbone system bus interface.

Design and optimization of integrated circuits are essential to the creation of new semiconductor chips, and physical optimizations are becoming more prominent as a result of semiconductor scaling. Modern chip design has become so complex that it is largely performed by specialized software, which is frequently updated to address advances in semiconductor technologies and increased problem complexities. A user of such software needs a high-level understanding of the underlying mathematical models and algorithms. On the other hand, a developer of such software must have a keen understanding of computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact.

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