Wafer Level 3-D ICs Process Technology
Chuan Seng Tan, Ronald J. Gutmann, L. Rafael Reif, "Wafer Level 3-D ICs Process Technology"
Springer | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB
Springer | 2008 | ISBN: 0387765328 | 410 pages | PDF | 11,1 MB
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging.
This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Not all books on AvaxHome appear on the homepage.
In order not to miss many of them follow ebooks section (see top of each page on AH)
and visit my blog too :)
In order not to miss many of them follow ebooks section (see top of each page on AH)
and visit my blog too :)
NO MIRRORS according to the rules