Reliability of MEMS: Testing of Materials and Devices
Osamu Tabata, Toshiyuki Tsuchiya, Oliver Brand, Gary K. Fedder, Christofer Hierold, Jan G. Korvink "Reliability of MEMS: Testing of Materials and Devices"
Wiley-VCH | 2008-02-15 | ISBN: 3527314946 | 324 pages | PDF | 5,5 MB
Wiley-VCH | 2008-02-15 | ISBN: 3527314946 | 324 pages | PDF | 5,5 MB
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies – nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.