Introduction To Semiconductor Process Technology

Photolithography Section

What you'll learn

You will gain a comprehensive understanding of photolithography technology.

You will understand the photoresist coating methods and the impact of poor photoresist thickness distribution.

You will understand the overview and methods of the prebake process.

You will understand the overview of the exposure process, pattern resolution, depth of focus, and alignment.

You will understand the overview of the development process and its key parameters.

Requirements

None

Description

“Zero to Understanding: Semiconductor Process Technology Course - Photolithography Edition” is a course designed to help beginners learn about photolithography, one of the most essential technologies in semiconductor manufacturing. Even if you have no prior knowledge of the field, this course provides a structured and accessible learning experience.Photolithography plays a crucial role in defining circuit patterns on semiconductor wafers, making it a key process in modern chip fabrication. To ensure a solid foundation, we start by explaining fundamental terminology and providing an overview of the entire photolithography process. You will learn step by step how photoresist is applied to wafers, followed by exposure, baking, and development.To make complex concepts easier to understand, we use diagrams and clear explanations to illustrate each stage of the process. You will also gain insights into key parameters that influence photolithography, such as exposure light sources, alignment techniques, and development conditions. By the end of this course, you will understand how precise patterns are transferred onto wafers and why each step is essential for semiconductor manufacturing.This course is ideal for students, engineers, and anyone interested in semiconductor technology. Whether you aim to work in the industry or simply want to expand your knowledge, this course will provide valuable insights.Join us as we explore photolithography from the ground up and build a strong foundation in semiconductor process technology!

Overview

Section 1: Introduction

Lecture 1 Course Introduction

Section 2: Overview of the Photolithography Process

Lecture 2 Summary of the photolithography process

Lecture 3 Position of the photolithography step within the overall semiconductor process

Lecture 4 Process flow of photolithography and the role of each step

Lecture 5 Recap

Section 3: About Photoresist

Lecture 6 Components and types of photoresist

Lecture 7 Reaction mechanism of photoresist(1)

Lecture 8 Recap

Section 4: Coating Process

Lecture 9 Position of the coating process within the overall flow

Lecture 10 Coating Method Part 1 Spin Coating

Lecture 11 Coating Method Part 2: Coating Sequence

Lecture 12 Types of Coating Methods: Static Coating, Dynamic Coating

Lecture 13 Impact of coating distribution variation on products

Lecture 14 Reasons for product impact:

Lecture 15 Cause 1: Non-uniform exposure dose

Lecture 16 Cause 2: Focus misalignment during exposure

Lecture 17 Cause 3: Variation in development process

Lecture 18 Key physical parameters determining coating distribution

Lecture 19 Recap

Section 5: Pre-Bake

Lecture 20 Position of the pre-bake step within the overall flow

Lecture 21 Purpose of the pre-bake process

Lecture 22 Types of pre-bake methods

Lecture 23 Impact of pre-bake temperature

Lecture 24 Recap

Section 6: Exposure Process 1

Lecture 25 Position of the exposure process within the overall flow

Lecture 26 Purpose of the exposure process

Lecture 27 About photomasks

Lecture 28 Light used for exposure

Lecture 29 Parameters related to wavelength

Lecture 30 Definition of pattern resolution

Lecture 31 OK/NG criteria for pattern resolution

Lecture 32 Relationship between NA, pattern resolution, and depth of focus

Lecture 33 What is NA (Numerical Aperture)?

Lecture 34 Relationship between NA and pattern resolution – Formula

Lecture 35 Relationship between NA and depth of focus – Formula

Section 7: Exposure Process 2

Lecture 36 About alignment

Lecture 37 How high-precision alignment is required

Lecture 38 Basic concept of alignment technology

Lecture 39 Structure of exposure equipment

Lecture 40 Types of misalignment that can occur

Lecture 41 Countermeasures for “position misalignment” and “rotation misalignment"

Lecture 42 Countermeasures for distortion misalignment and expansion misalignment

Lecture 43 Recap

Section 8: Development

Lecture 44 Position of the development process within the overall flow

Lecture 45 Purpose of the development process

Lecture 46 Development process flow

Lecture 47 Types of developer solutions

Lecture 48 Key parameters during development

Lecture 49 Recap

Entry-level process engineers interested in semiconductor process technology,Anyone interested in semiconductors.