"Heat Transfer: Models, Methods and Applications" ed. by Konstantin Volkov

The book focuses on new analytical, experimental, and computational developments in the field of research of heat and mass transfer phenomena.

The generation, conversion, use, and exchange of thermal energy between physical systems are considered. Various mechanisms of heat transfer such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes are presented. Theory and fundamental research in heat and mass transfer, numerical simulations and algorithms, experimental techniques, and measurements as they applied to all kinds of applied and emerging problems are covered.


Contents
1 Free Convection Heat Transfer from Different Objects
2 Use of CFD Codes for Calculation of Radiation Heat Transfer: From Validation to Application
3 Probabilistic Heat Transfer Problems in Thermal Protection Systems
4 Gas-Liquid Stratified Flow in Pipeline with Phase Change
5 Boiling Heat Transfer: Convection Controlled by Nucleation
6 Calculations of Heat Transfer in the Furnaces of Steam Boilers According to the Laws of Radiation of Gas Volumes
7 Conjugate Heat Transfer of an Internally Air-Cooled Nozzle Guide Vane and Shrouds
8 Photonic Metamaterials: Controlling Nanoscale Radiative Thermal Transport
9 Heat Transfer Analysis without and with Forward Facing Spike Attached to a Blunt Body at High Speed Flow
10 A Review of Heat Transfer Enhancement Methods Using Coiled Wire and Twisted Tape Inserts
11 Experimental Study of Concave Rectangular Winglet Vortex Generators Effect on Thermal-Hydrodynamic Performances of Airflow inside a Channel
12 Heat Transfer of Helix Energy Pile: Part 1: Traditional Cylinder Helix Energy Pile
13 Heat Transfer of Helix Energy Pile: Part 2—Novel Truncated Cone Helix Energy Pile
14 Techniques for the Fabrication of Super-Hydrophobic Surfaces and Their Heat Transfer Applications
15 Spouted Bed and Jet Impingement Fluidization in Food Industry
16 High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging