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Assembly and Reliability of Lead-Free Solder Joints

Posted By: roxul
Date: 29 May 2020 08:37:38
Assembly and Reliability of Lead-Free Solder Joints

John H. Lau, "Assembly and Reliability of Lead-Free Solder Joints"
English | ISBN: 9811539197 | 2020 | 548 pages | PDF | 44 MB

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
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