Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Repost)
Integrated Interconnect Technologies for 3D Nanoelectronic Systems By Muhannad S. Bakir, James D. Meindl
2008 | 528 Pages | ISBN: 1596932465 | PDF | 13 MB
2008 | 528 Pages | ISBN: 1596932465 | PDF | 13 MB
Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.