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    3. 3D IC Stacking Technology [Repost]

    3D IC Stacking Technology [Repost]

    Posted By: AlenMiler
    Date: 7 Jul 2015 11:22:52
    3D IC Stacking Technology [Repost]

    3D IC Stacking Technology by Banqiu Wu
    English | July 7, 2011 | ISBN: 007174195X | 544 Pages | EPUB | 11 MB

    With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

    3D IC Stacking Technology covers:

    High density through silicon stacking (TSS) technology
    Practical design ecosystem for heterogeneous 3D IC products
    Design automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack
    Process integration for TSV manufacturing
    High-aspect-ratio silicon etch for TSV
    Dielectric deposition for TSV
    Barrier and seed deposition
    Copper electrodeposition for TSV
    Chemical mechanical polishing for TSV applications
    Temporary and permanent bonding
    Assembly and test aspects of TSV technology
    Download here: NitroFlare
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