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    3. 3D and Circuit Integration of MEMS

    3D and Circuit Integration of MEMS

    Posted By: hill0
    Date: 12 Feb 2022 07:00:27
    3D and Circuit Integration of MEMS

    3D and Circuit Integration of MEMS
    English | 2021 | ISBN: 3527346473 | 502 Pages | PDF | 28 MB

    MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration.

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