3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Ibrahim (Abe) M. Elfadel and Gerhard Fettweis, "3D Stacked Chips: From Emerging Processes to Heterogeneous Systems"
2016 | ISBN-10: 3319204807 | 339 pages | EPUB | 9 MB
2016 | ISBN-10: 3319204807 | 339 pages | EPUB | 9 MB
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.