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    3. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems (Repost)

    3D Stacked Chips: From Emerging Processes to Heterogeneous Systems (Repost)

    Posted By: step778
    Date: 4 Jun 2022 10:43:00
    3D Stacked Chips: From Emerging Processes to Heterogeneous Systems (Repost)

    Ibrahim (Abe) M. Elfadel, Gerhard Fettweis, "3D Stacked Chips: From Emerging Processes to Heterogeneous Systems"
    English | 2016 | pages: 354 | ISBN: 3319204807 | PDF | 16,3 mb

    This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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