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    3. New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

    New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

    Posted By: Underaglassmoon
    Date: 7 Jun 2017 17:00:42
    New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation

    New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation
    Morgan & Claypool | English | 2016 | ISBN-10: 1627058540 | 82 pages | PDF | 3.68 mb

    by Nabil Shovon Ashraf (Author)

    In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures
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