Direct-Write Technologies for Rapid Prototyping. Sensors, Electronics, and Integrated Power Sources

Content: Preface, Pages xix-xxiiContributors, Pages xxiii-xxviChapter 1 - Introduction to Direct-Write Technologies for Rapid Prototyping, Pages 1-13Introduction, Page 15Chapter 2 - Overview of Commercial and Military Application Areas in Passive and Active Electronic Devices, Pages 17-31Chapter 3 - Role Of Direct-Write Tools and Technologies for Microelectronic Manufacturing, Pages 33-54Chapter 4 - Direct-Write Materials and Layers for Electrochemical Power Devices, Pages 55-92Chapter 5 - The Role of Direct Writing For Chemical and Biological Materials: Commercial and Military Sensing Applications, Pages 93-120Introduction, Pages 121-122Chapter 6 - Advanced Materials Systems for Ultra-Low-Temperature, Digital, Direct-Write Technologies, Pages 123-174Introduction, Pages 175-176Chapter 7 - Direct Write Using Ink-Jet Techniques, Pages 177-227Chapter 8 - Micropen Printing of Electronic Components, Pages 229-259Chapter 9 - Direct-Write Thermal Spraying of Multilayer Electronics and Sensor Structures, Pages 261-302Chapter 10 - Dip-Pen Nanolithography: Direct Writing Soft Structures on the Sub-100-Nanometer-Length Scale, Pages 303-312Chapter 11 - Nanolithography with Electron Beams: Theory and Practice, Pages 313-346Chapter 12 - Focused Ion Beams for Direct Writing, Pages 347-383Chapter 13 - Laser Direct-Write Micromachining, Pages 385-414Chapter 14 - 3D Microengineering via Laser Direct-Write Processing Approaches, Pages 415-474Chapter 15 - Flow- and Laser-Guided Direct Write of Electronic and Biological Components, Pages 475-492Chapter 16 - Laser-Induced Forward Transfer: An Approach to Single-Step Microfabrication, Pages 493-516Chapter 17 - Matrix Assisted Pulsed Laser Evaporation-Direct Write (Maple-Dw): A New Method to Rapidly Prototype Organic and Inorganic Materials, Pages 517-553Introduction, Page 555Chapter 18 - Technologies for Micrometer and Nanometer Pattern and Material Transfer, Pages 557-679Appendix A - Ancillary Technologies, Pages 680-701Index, Pages 702-726