SiP-System in Package Design and Simulation: Mentor EE Flow Advanced Design Guide
(Li Yang), Suny Li, "SiP-System in Package Design and Simulation: Mentor EE Flow Advanced Design Guide"
English | ISBN: 1119045932 | 2017 | 496 pages | PDF | 84 MB
English | ISBN: 1119045932 | 2017 | 496 pages | PDF | 84 MB
An advanced reference documenting, in detail, every step of a real System–in–Package (SiP) design flow
Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real–time DRC (design rule checking), and SiP manufacture.
Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:
Cavity and sacked dies design
FlipChip and RDL design
Routing and coppering
3D Real–Time DRC check
SiP simulation technology
Mentor SiP Design and Simulation Platform
Designed to function equally well as a reference, tutorial, and self–study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.