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    3. 3D IC Stacking Technology

    3D IC Stacking Technology

    Posted By: insetes
    Date: 27 Jan 2022 14:50:39
    3D IC Stacking Technology

    3D IC Stacking Technology By Banqiu Wu,Ajay Kumar,Sesh Ramaswami
    2011 | 373 Pages | ISBN: 007174195X | EPUB | 11 MB


    The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers:High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper...
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