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    3. Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

    Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

    Posted By: readerXXI
    Date: 20 Jun 2019 18:09:46
    Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

    Power, Thermal, Noise, and Signal
    Integrity Issues on Substrate/Interconnects Entanglement
    by Yue Ma and Christian Gontrand
    English | 2019 | ISBN: 0367023431 | 241 Pages | PDF | 17 MB

    As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.

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