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3D IC Integration and Packaging

Posted By: arundhati
Date: 23 Apr 2023 00:28:52
3D IC Integration and Packaging

John Lau, "3D IC Integration and Packaging "
English | ISBN: 0071848061 | 2015 | 480 pages | PDF | 170 MB

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.



A comprehensive guide to 3D IC integration and packaging technology





















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